12:18 - 8.01.2025

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January 8, Fineko/abc.az. Construction of 18 new chip factories around the world is planned. Only three of them will work with silicon wafers of standard size of 200 mm, and the rest provide for work with standard size of 300 mm.

ABC.AZ reports that the main part of the enterprises, whose construction will start this year, should begin operating in the period from 2026 to 2027, according to the forecast of SEMI industry association. The U.S. and Japan should become the leaders in the number of enterprises being rebuilt in the semiconductor industry this year, since each of the macro-regions will launch four projects. Three projects will be launched in China and the EME region (Europe and the Middle East). Taiwan will limit itself to two enterprises, and their construction will be launched this year. Southeast Asia and South Korea will be limited to one enterprise in each case.

If there are currently more than 1,500 enterprises and production lines for manufacture of chips in the world, then after 2024 about 180 enterprises and lines will be put into operation, on the condition that producers will not abandon their plans.